DA400 Multi-wire Saw
Applicable Material:Sapphire, Special Ceramics, Silicon Nitride and other super hard and brittle materials.
Max Processing Size: φ125x400mm
Cut Shape: Straight shape
Max Wire Speed: 1200m/min


1.Product Introduction

DA400 Multi-wire Saw is mainly designed for batch processing of Sapphire, Special Ceramics, Silicon Nitride and other super hard and brittle materials into straight sheets. The machine is designed with double work stations and can achieve the cutting of super hard and brittle materials with workpiece swinging to reduce cutting area.


> The machine adopts double-station design and is able to cut two plates materials at the same time, which greatly improves the working efficiency.

Achieve the cutting of both thick and thin sheets with the flexible wire winding for 3 rollers and five rollers.

The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire net shaking.

The main operation door can be raised and lowered electrically with safety device.

The cutting room is open on 3 sides for easier operation and maintenance.

Wire break memory system.


3.Cutting sample 

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 DCX-1000-2.png  DCX-1000-3.png

4. Parameter

2AbilityMaximum work sizeΦ125x400mm
3Wire Guide RollerOut diameter *Workable widthΦ165±10*410mm*5 rollers
4Diamond wireWire diameterφ0.12mm-φ0.25mm
5Storage (PV600 reinforced I-wheel)40km(φ0.25mm)
6Maximum running speed1200m/min
8Travel of table245mm
9Table swing±7°
10Cutting methodVertically downward movement
11Cutting feed speed0.1~99.9mm/min
12Cutting fluidFluidWater-based cutting fluid or cutting oil
14Flow rate200L/min
15PowerPower supply380V±10%  50Hz
17Air supplyAdopting water-based cutting fluid, the air pressure is ≥ 0.35 MPa.
18Size & WeightSize L*W*H3150mm*1900mm*2920mm

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