-Defined cutting of round and rectangular Sapphire/Quartz Crystal/Optics cores of different sizes and shapes.

-Accuracy 0.01mm (all axes).

-No thermal influences on the workpiece material during the cutting process.

-Cutting speed/ feed speed freely selectable according to customer's requirements.

-CE Conformity.

• Bow: Smaller
• Warp: Smaller
• Good parallelism
• Total thickness tolerance: Smaller
• Low cutting loss between slices
• The surface damage layer of the processed wafer is shallow and the roughness is smaller
• High efficiency
• High productivity
• High return on investment