Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.

Features

2 workbenches make high production&efficiency.

Swing slicing makes stronger cutting force.

More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.

Wire break memory system.

HMI is easy to operate.

Underside workbench, the workbench is upward movement.

Much stable, the whole-casted frame makes running stably.

Cutting sample

Parameter