This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.
2 workbenches make high production&efficiency.
Swing slicing makes stronger cutting force.
More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.
Wire break memory system.
HMI is easy to operate.
Underside workbench, the workbench is upward movement.
Much stable, the whole-casted frame makes running stably.
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