Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.

Features

Swing slicing makes stronger cutting force.

Good choice for large size cutting material.

Quieter, the noise less than 80db.

High-speed, the fastest wire speed can be achieved at 1500m/min.

Wire break memory system.

HMI is easy to operate.

Much stable, the whole-casted frame makes running stably.

Cutting sample

Parameter