DF900 Multi-wire Saw for Cutting Silicon Wafers
Applicable Material:Silicon Wafers

Max Processing Size(L×W×H):230mm×230mm×900mm/φ230mm×900mm

Cut Shape: Straight shape

Max Wire Speed: 2400m/min

Description

DF900 Multi-wire Saw is a specialized equipment deisgned for photovoltaic materials with advantages of large size, high accuracy and large capacity. It can be compatible with a variety of large-size products, and the cutting length can reach 900mm, adding a powerful tool for the photovoltaic industry.


Features

  •  3 rollers design, it can achieve fast switching of multi-specification products(166, 182, 210 and 230) with high compatibility.

  • Optimized cutting roller space for little wire curve, high cutting speed and high quality.

  • The whole casting structure has high damping coefficient and excellent vibration damping performance.

  • The wire spools are located under the cutting room and run stably, which can meet the cutting requirements of high wire speed, high quality and low wire consumption.

  • Adopting high speed axle box, the maximum wire speed is up to 2400m/min with large load and high accuracy.

  • Optimized rollers distance and wire winding space brings small torsion force and tension fluctuation. The unilateral torsion is less than 5 turns, and the breaking rate is less than 0.5%.

  • The control system saves energy and consumption, and has the function of continuous wire during power failure.



Cutting sample

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Parameter

DetailParameter
ModelDF900
Maximum work size(166-230)*900mm
Roller out diameterφ180-170
Roller weight94kg
Roller quantity3
Wire diameter0.025-0.16mm
Wire spool storage120km
Maximum running speed2400m/min
Travel of table345mm
Fluid storage600L
Fluid flow rate13000L/H
Power supply380V±10%  50HZ (Host)
Rated power274KW
Size L*W*H4400x2100x3100mm
Weight15000kg


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