CX4040 Diamond Multi-wire Cutting Machine
Applicable Material:sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, and other hard and valuable materials.

Max Processing Size:400*250*400mm×2(Double Worktable)

Cut Shape: Straight shape

Max Wire Speed: 1000m/min


Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.


2 workbenches make high production&efficiency.

Swing slicing makes stronger cutting force.

More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.

Wire break memory system.

HMI is easy to operate.

Underside workbench, the workbench is upward movement.

Much stable, the whole-casted frame makes running stably.

Cutting sample

optics-2-300x260.jpg  4.Special-Ceramics-slice-cutting-by-diamand-wire-3

3.Quarz-Crystal-slice-cutting-by-diamond-wire-300x  2.Sapphire-slice-cutting-by-diamond-wire-1-300x225


AbilityMaximum work size L*W*H400mm*260mm*400mm×2
Thickness of slice5mm~30mm
WorkbenchTravel of worktableMax422mm
Number of Worktable2
RollerOuter Diameter* Workable widthφ190mm±10*250mm
ComponentResin(PE or PU)
Diamond WireWire diameterφ0.25mm-φ0.37mm
Running speed1000m/min
Lift speed0.1-99.9mm/min
Fast feed speed300mm/min
PowerPowerThree-phase 380V 50Hz
Size & WeightSize L*W*H3000mm×2400mm×2400mm

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