CX2223 Diamond Wire Saw
Applicable Material:sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, electrode material, semiconductor materials, rare metals and alloys, and other hard and valuable materials.

Max Processing Size:160×220×230mm×2(Double Worktable)

Cut Shape: Straight shape

Max Wire Speed: 1000m/min


Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.


2 workbenches make high production&efficiency.

More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.

Wire break memory system.

HMI is easy to operate.

Underside workbench, the workbench is upward movement.

Much stable, the whole-casted frame makes running stably.

Cutting sample

氧化铝切片-2-300x225.jpg  硅-300x225.jpg

Optics-300x225.jpg  2.Sapphire-slice-cutting-by-diamond-wire-300x225.j


AbilityMaximum work size L*W*H204mm×260mm×220mm×2
Thickness of slice 5mm~30mm
RollerOut diameter *workable widthφ160mm-φ185*210mm
ComponentResin(PE or PU)
Diamond wireWire diamondφ0.20mm-φ0.37mm
Running speed1000m/min
WorkbenchTravel of tableMax240mm
Lift speed0.1-99.9mm/min
Fast feed speed150mm/min
Number of workbench2
PowerPowerThree-phase 380 V 50Hz

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