Product

Diamond Wire
2020-09-22
LC100 Laser Cutting Machine
2020-12-21

CX800 Diamond Multi-wire cutting machine

Applicable Material:sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, electrode material, semiconductor materials, rare metals and alloys, and other hard and valuable materials.

Max Processing Size:210×400×190mm*2(double-station)

Cut Shape: Straight shape

Max Wire Speed: 1500m/min

Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.

Features

  • 2 workbenches make high production&efficiency.
  • Upper workbench, the workbench is downward movement.
  • Fewer guide wheels, the quantity reduced to 7 to reduce wire disconnection.
  • More selection for slices, it can achieve final slice thickness is 0.5mm~60mm.
  • High-speed, the fastest wire speed can be achieved at 1500m/min.
  • Wire break memory system.
  • HMI is easy to operate.
  • Much stable, the whole-casted frame makes running stably.
  • Easy operation, the opening workspace makes operation easier.

Cutting sample

Parameter

ItemDetailParameter
ModelModelCX800
AbilityMaximum work size L*W*H210mm×400mm×190mm*2
Thickness of slice0.5mm~60mm
RollerOut diameter *Workable widthφ165mm±10*410mm
Spindle Space405mm
ComponentResin(PE or PU)
Diamond wireWire diameterφ0.12mm-φ0.25mm
Storage30km(φ0.12mm)
Running speed1500m/min
WorkbenchTravel of tableMax245mm
Lift speed0.1-99.9mm/min
Fast feed speed200mm/min
Number of workbench2
Cutting fluidFluidCutting Oil
Storage800L
Flow rate250L/min
PowerPowerThree-phase 380V 50Hz
Rated power35kva
Size&WeightSize2605mm*1900mm*2835mm
Weight6500Kg
Installation site7000kg Affordable