CA400 Swing Diamond Multi-wire Saw
2018-09-06
CX5050 Diamond Single Wire Cutting Machine
2018-09-06

CX2223 Diamond Wire Saw

Applicable Material:sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, electrode material, semiconductor materials, rare metals and alloys, and other hard and valuable materials.

Max Processing Size:160×220×230mm×2(Double Worktable)

Cut Shape: Straight shape

Max Wire Speed: 1000m/min

Product Introduction

This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.

Features

  • 2 workbenches make high production&efficiency.
  • More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.
  • Wire break memory system.
  • HMI is easy to operate.
  • Underside workbench, the workbench is upward movement.
  • Much stable, the whole-casted frame makes running stably.

Cutting sample

Parameter

ItemDetailParameter
ModelModelCX2223
AbilityMaximum work size L*W*H204mm×260mm×220mm×2
Thickness of slice 5mm~30mm
RollerOut diameter *workable widthφ160mm-φ185*210mm
ComponentResin(PE or PU)
Diamond wireWire diamondφ0.20mm-φ0.37mm
StorageMax20km
Running speed1000m/min
WorkbenchTravel of tableMax240mm
Lift speed0.1-99.9mm/min
Fast feed speed150mm/min
Number of workbench2
PowerPowerThree-phase 380 V 50Hz
Size&WeightSize2500mm×2400mm×2400mm
Weight2800Kg