Applicable Material:sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, electrode material, semiconductor materials, rare metals and alloys, and other hard and valuable materials.
Max Processing Size:160×220×230mm×2(Double Worktable)
Cut Shape: Straight shape
Max Wire Speed: 1000m/min
Product Introduction
This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.
Features
Cutting sample
Parameter
Item | Detail | Parameter |
Model | Model | CX2223 |
Ability | Maximum work size L*W*H | 204mm×260mm×220mm×2 |
Thickness of slice | 5mm~30mm | |
Roller | Out diameter *workable width | φ160mm-φ185*210mm |
Component | Resin(PE or PU) | |
Diamond wire | Wire diamond | φ0.20mm-φ0.37mm |
Storage | Max20km | |
Running speed | 1000m/min | |
Workbench | Travel of table | Max240mm |
Lift speed | 0.1-99.9mm/min | |
Fast feed speed | 150mm/min | |
Number of workbench | 2 | |
Power | Power | Three-phase 380 V 50Hz |
Size&Weight | Size | 2500mm×2400mm×2400mm |
Weight | 2800Kg |